Cu Bonding Wires

  taya pcc2

Our copper bonding wires  are bare copper wires and palladium coated copper bonding wire well suited as semiconductor interconnect material replacing gold wires in the IC packaging assembly.

These copper bonding wires have passed workmanship, quality and reliability based on different customer specifications and requirements.

Current applications ranges from leaded to laminate bonding applications suited for thin Al pad thickness, bond-on-active-circuit, 100% Au bond pad, and, multi-tier via bonding pad.